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US Patent 11856727 Cooling system for computer components
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Patent
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Date Filed
March 13, 2019
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Date of Patent
December 26, 2023
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Patent Application Number
17438232
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Patent Citations
US Patent 11357131 Fluid breakdown detection systems and processes useful for liquid immersion cooling
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US Patent 10624242 System and method of packaging computing resources for space and fire-resistance
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US Patent 10969842 Chassis for a liquid immersion cooling system
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Patent Citations Received
US Patent 12136576 Microelectronic module
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US Patent 12089368 System and method for cooling computing devices using a primary circuit dielectric cooling fluid
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Patent Inventor Names
Joan Besares Matas
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Jordi Bricollé Sancho
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David Montes Monteserin
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Miguel Giner Gutiérrez
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Pol Valls Soler
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Daniel Esteve Pope Palacín
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11856727
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Patent Primary Examiner
Courtney L Smith
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