Patent attributes
Disclosed is a head-mounted temperature adjustment device, including a cap body, a temperature conduction sheet, and a temperature adjustment assembly. The temperature adjustment assembly includes a semiconductor temperature adjustment member and a fan, the temperature conduction sheet and the semiconductor temperature adjustment member are thermally conducted and both disposed in the cap body, the temperature conduction sheet is located on a side of the semiconductor temperature adjustment member facing a human head, and the fan is disposed on a side of the semiconductor temperature adjustment member facing away from the human head. In the above solution of the present disclosure, the head-mounted temperature adjustment device can be switched between a cooling mode and a heating mode to warm or cool the human head.
