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US Patent 11858088 Polishing apparatus

Patent 11858088 was granted and assigned to Disco Corporation on January, 2024 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Disco Corporation
Disco Corporation
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Date Filed
March 22, 2022
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Date of Patent
January 2, 2024
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Patent Applicant
Disco Corporation
Disco Corporation
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Patent Application Number
17655811
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Patent Citations
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US Patent 8955530 System and method for cleaning a wafer chuck
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US Patent 9393669 Systems and methods of processing substrates
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US Patent 11120985 Substrate transfer device, substrate processing system, substrate processing method and computer-readable recording medium
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US Patent 11559869 Wafer edge polishing apparatus and method
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US Patent 11203094 Substrate cleaning device, substrate processing apparatus, substrate cleaning method and substrate processing method
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US Patent 7238087 Planarizing device and a planarization method for semiconductor substrates
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US Patent 7306509 Processing device, processing method and method of manufacturing semiconductor device
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US Patent 7637802 Lapping plate resurfacing abrasive member and method
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US Patent 7655316 Cleaning of a substrate support
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US Patent 8366514 Semiconductor substrate planarization apparatus and planarization method
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Patent Inventor Names
Takamasa Suzuki
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Toshiyuki Moriya
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Jai Kwang Han
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Yuki Inoue
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11858088
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Patent Primary Examiner
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Don M Anderson
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