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US Patent 11862874 Antenna structure and antenna-in-package
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Patent
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Date Filed
April 11, 2022
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Date of Patent
January 2, 2024
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Patent Application Number
17717201
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Patent Citations
US Patent 11050138 Combo sub 6GHz and mmWave antenna system
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US Patent 11355838 Integration of EBG structures (single layer/multi-layer) for isolation enhancement in multilayer embedded packaging technology at mmWave
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US Patent 10804227 Semiconductor packages with antennas
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Patent Inventor Names
Wei Huang
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11862874
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Patent Primary Examiner
Dieu Hien T Duong
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CPC Code
H01Q 9/0414
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H01Q 1/02
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H01Q 5/378
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