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US Patent 11862901 Interposer

Patent 11862901 was granted and assigned to Teradyne on January, 2024 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Teradyne
Teradyne
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Date Filed
December 15, 2020
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Date of Patent
January 2, 2024
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Patent Applicant
Teradyne
Teradyne
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Patent Application Number
17122579
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Patent Citations
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US Patent 6916990 High power interface
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US Patent 6927585 Membrane probing system with local contact scrub
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US Patent 6927586 Temperature compensated vertical pin probing device
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US Patent 6930498 Membrane probing system
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US Patent 6939175 Coaxial cable for overvoltage protection
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US Patent 6951482 Controlled-impedance coaxial cable interconnect system
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US Patent 6963211 Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment
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US Patent 6965244 High performance probe system
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US Patent 7078890 Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment
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US Patent 7084657 Bump and method of forming bump
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•••
Patent Inventor Names
Michael F. Halblander
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Michael Herzog
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Diwakar Saxena
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Frank Parrish
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Edward Dague
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11862901
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Patent Primary Examiner
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Minh Q Phan
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CPC Code
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H01R 2201/20
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H01R 13/6587
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H01R 12/515
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H01R 13/2428
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