Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kenneth F. Flower0
Date of Patent
January 9, 2024
0Patent Application Number
173335520
Date Filed
May 28, 2021
0Patent Citations
Patent Primary Examiner
Patent abstract
A package system is provided that includes a main body having a bilayer thermoplastic laminated film structure including a first layer and a second layer with an adhesive layer disposed between the first layer and the second layer. The main body can further include an array of holes and a removable panel disposed on the array of holes. The removable panel can include a plurality of cutouts, where each one of the cutouts corresponds to one of the holes. The removable panel can be configured to be selectively pulled off the main body.
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