US Patent 11870142 Tile to tile RF grounding

An assembly comprises a first subassembly, a second subassembly, and a conductive grounding element. The first subassembly comprises a first module comprising a first ground plane and a first conductive region in operable communication with the first ground plane. The second subassembly comprises a second module comprising a second ground plane distinct from the first ground plane and a second conductive region in operable communication with the second ground plane. The first and second subassemblies attach to each other along a seam. The conductive grounding element comprises an electrically conductive material including a first portion disposed adjacent to the first conductive region and a second portion disposed adjacent the second conductive region. The conductive grounding element is configured to fill one or more gaps in the seam and to operably couple together the first and second ground planes of the first and second subassemblies into a third common ground plane.