US Patent 11872626 Systems and methods for floating pin joint design

Techniques for joining nodes and subcomponents are presented herein. An apparatus in accordance with an aspect of the present disclosure comprises a 3-D printed first part having an interconnect co-printed with the first part such that the interconnect of the first part can float within the first part, and a 3-D printed second part having an interconnect co-printed with the second part such that the interconnect of the second part can float within the second part, wherein the interconnects of the first and second parts are configured to form a connection between the first and second parts.