US Patent 11874070 Spinodal structures with bi-continuous topologies for heat transfer applications

Heat transfer devices, components thereof, and related methods are provided. Embodiments include heat transfer devices and/or heat transfer components including a spinodal structure having a bi-continuous topology obtained by modeling a spinodal decomposition process, wherein the spinodal structure having the bi-continuous topology is a spinodal shell structure or a spinodal solid structure. Embodiments include methods of making heat transfer devices and/or heat transfer components using additive manufacturing. Other further embodiments are provided in the present disclosure.