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US Patent 11875978 Plasma processing apparatus and plasma processing method

Overview Structured Data Issues Contributors Activity

Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Shigeru Nakamoto0

Miyako Matsui0

Atsushi Sekiguchi0

Tatehito Usui0

Tsubasa Okamoto0

Naohiro Kawamoto0

Date of Patent

January 16, 2024

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Patent Application Number

174393180

Date Filed

June 16, 2020

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Patent Citations

US Patent 7190119 Methods and apparatus for optimizing a substrate in a plasma processing system

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US Patent 7645357 Plasma reactor apparatus with a VHF capacitively coupled plasma source of variable frequency

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US Patent 8038896 Plasma processing method and apparatus

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US Patent 8546266 Plasma processing method and plasma processing apparatus

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US Patent 9548228 Void free tungsten fill in different sized features

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US Patent 9431268 Isotropic atomic layer etch for silicon and germanium oxides

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US Patent 9978610 Pulsing RF power in etch process to enhance tungsten gapfill performance

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US Patent 6919689 Method for toolmatching and troubleshooting a plasma processing system

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Patent Primary Examiner

Roberts P Culbert

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Patent abstract

A plasma processing apparatus

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