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US Patent 11876277 High-frequency component

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
July 31, 2019
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Date of Patent
January 16, 2024
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Patent Application Number
17265379
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Patent Citations
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US Patent 10685924 Antenna-on-package arrangements
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US Patent 11394094 Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements
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US Patent 11362436 Plastic air-waveguide antenna with conductive particles
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US Patent 11532867 Heterogeneous antenna in fan-out package
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US Patent 9583811 Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound
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US Patent 9978676 Sub-terahertz/terahertz interconnect
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Patent Inventor Names
Winfried Mayer
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Martin Hitzler
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11876277
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Patent Primary Examiner
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Adam D Houston
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CPC Code
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H01L 23/481
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H01L 23/5286
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H01L 23/28
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H01L 24/16
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H01L 2224/16225
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H05K 1/0237
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H05K 1/181
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G01F 23/284
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H01P 5/08
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H01P 3/12
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