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US Patent 11876343 Laser diode packaging platforms
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Patent
0
Date Filed
May 18, 2021
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Date of Patent
January 16, 2024
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Patent Application Number
17323329
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Patent Citations
US Patent 7944956 Heat sink, laser apparatus provided with such heat sink, and laser stack apparatus
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US Patent 7060515 Method of manufacturing a laser diode package
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US Patent 7092420 Submount of semiconductor laser diode, method of manufacturing the same, and semiconductor laser diode assembly using the submount
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US Patent 7154926 Laser diode module, laser apparatus and laser processing apparatus
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US Patent 7664153 Laser diode array, optical scanning device and printing apparatus
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US Patent 8000360 Laser diode assemblies
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US Patent 8213479 High power diode laser having multiple emitters and method for its production
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US Patent 8611389 Light emitting device and package component
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US Patent 8804781 Macro channel water-cooled heat-sink for diode-laser bars
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US Patent 9001856 Diode laser bar mounted on a copper heat-sink
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•••
Patent Inventor Names
Thilo Vethake
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Stefan Heinemann
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Le Zhao
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Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
11876343
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Patent Primary Examiner
Kinam Park
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CPC Code
H01S 5/0239
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H01S 5/02469
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H01S 5/4012
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H01S 5/4018
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H01S 5/02365
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H01S 5/4031
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H01S 5/02345
0
H01S 5/0237
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H01S 5/042
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H01S 5/02251
0
•••
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