Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11881433 Advanced copper interconnects with hybrid microstructure

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
December 9, 2021
0
Date of Patent
January 23, 2024
0
Patent Application Number
17546511
0
Patent Citations
‌
US Patent 10615074 Advanced copper interconnects with hybrid microstructure
0
‌
US Patent 9799605 Advanced copper interconnects with hybrid microstructure
0
‌
US Patent 10276435 Advanced copper interconnects with hybrid microstructure
0
‌
US Patent 6864152 Fabrication of trenches with multiple depths on the same substrate
0
‌
US Patent 6932916 Semiconductor substrate with trenches of varying depth
0
‌
US Patent 6969686 Memory device having isolation trenches with different depths and the method for making the same
0
‌
US Patent 7284958 Separable blade platform
0
‌
US Patent 7318577 Motor-operated valve assembly
0
‌
US Patent 7545040 Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor device
0
‌
US Patent 7566653 Interconnect structure with grain growth promotion layer and method for forming the same
0
•••
Patent Inventor Names
Daniel C. Edelstein
0
Chih-Chao Yang
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
11881433
0
Patent Primary Examiner
‌
Moin M Rahman
0
CPC Code
‌
H01L 21/288
0
‌
H01L 21/823475
0
‌
H01L 21/02164
0

Find more entities like US Patent 11881433 Advanced copper interconnects with hybrid microstructure

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo