US Patent 11887949 Bond pad layout including floating conductive sections
Is a
Date Filed
August 18, 2021
0
Date of Patent
January 30, 2024
0
Patent Application Number
17405812
0
Patent Inventor Names
Su-Chueh Lo
0
Jian-Syu Lin
0
Yi-Fan Chang
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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