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US Patent 11890697 System and method of additive manufacturing
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Patent
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Date Filed
October 20, 2021
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Date of Patent
February 6, 2024
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Patent Application Number
17506031
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Patent Citations
US Patent 10967460 Method for manufacturing a part by melting powder, the powder particles reaching the bath in a cold state
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US Patent 10105902 Electrophotography-based additive manufacturing with part molding
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US Patent 10682703 Systems and methods for delivering materials for printing three dimensional (3D) objects
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US Patent 7236166 High-resolution rapid manufacturing
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US Patent 8488994 Electrophotography-based additive manufacturing system with transfer-medium service loops
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US Patent 8718522 Layer transfusion with part heating for additive manufacturing
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US Patent 8747956 Processes, systems, and apparatus for forming products from atomized metals and alloys
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US Patent 8879957 Electrophotography-based additive manufacturing system with reciprocating operation
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US Patent 9346127 Apparatuses, systems and methods for three-dimensional printing
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US Patent 9821399 Wire arc accuracy adjustment system
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Patent Inventor Names
Ryan Chou
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Mark Stephen Lopac
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11890697
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Patent Primary Examiner
Eric S Stapleton
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CPC Code
B23K 26/123
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B23K 26/126
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B23K 26/128
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B23K 26/702
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B33Y 30/00
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B23K 26/342
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B33Y 10/00
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B23K 26/0869
0
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