US Patent 11890832 Prepreg and metallic clad laminate
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US Patent 11890832 Prepreg and metallic clad laminate
Article
Patent abstract
A prepreg and a metallic clad laminate are provided. The prepreg includes a reinforcing material and a thermosetting resin layer. The thermosetting resin layer is formed by immersing the reinforcing material in a thermosetting resin composition. The thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers. Based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr. The fillers include a granular dielectric filler and a flaky thermal conductive filler. The metallic clad laminate is formed by disposing at least one metal layer onto the prepreg.
Infobox
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Patent Jurisdiction
Patent Number
Patent Inventor Names
Chia-Lin Liu0
Chih-Kai Chang0
Hao-Sheng Chen0
Hung-Yi Chang0
Te-Chao Liao0
Date of Patent
February 6, 2024
0Patent Application Number
173166770
Date Filed
May 10, 2021
0Patent Citations
Patent Primary Examiner
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