US Patent 11894257 Single wafer processing environments with spatial separation
Patent 11894257 was granted and assigned to Applied Materials on February, 2024 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
October 26, 2018
0
Date of Patent
February 6, 2024
0
Patent Applicant
Patent Application Number
16171785
0
Patent Citations
•••
Patent Inventor Names
Michael Rice
0
Sanjeev Baluja
0
Joseph AuBuchon
0
Mandyam Sriram
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
CPC Code
Find more entities like US Patent 11894257 Single wafer processing environments with spatial separation
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
