Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11894265 Top via with damascene line and via

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
September 20, 2021
0
Date of Patent
February 6, 2024
0
Patent Application Number
17479346
0
Patent Citations
‌
US Patent 7947594 Interconnection structure with low dielectric constant
0
‌
US Patent 9613861 Damascene wires with top via structures
0
‌
US Patent 8611055 Magnetic etch-stop layer for magnetoresistive read heads
0
‌
US Patent 10049920 Reduced tip-to-tip and via pitch at line end
0
‌
US Patent 7259087 Semiconductor devices having a via hole and methods for forming a via hole in a semiconductor device
0
‌
US Patent 7326651 Method for forming damascene structure utilizing planarizing material coupled with compressive diffusion barrier material
0
Patent Inventor Names
Robert Robison
0
Lawrence A. Clevenger
0
Nicholas Anthony Lanzillo
0
Christopher J. Penny
0
Kisik Choi
0
Brent Anderson
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
11894265
0
Patent Primary Examiner
‌
Shahed Ahmed
0
CPC Code
‌
H01L 21/76865
0
‌
H01L 21/76885
0
‌
H01L 21/76883
0
‌
H01L 21/76852
0
‌
H01L 21/76834
0
‌
H01L 23/53266
0
‌
H01L 23/5226
0
‌
H01L 21/76879
0
‌
H01L 21/76802
0
‌
H01L 21/76843
0

Find more entities like US Patent 11894265 Top via with damascene line and via

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo