US Patent 11894322 Launch structures for radio frequency integrated device packages
Patent 11894322 was granted and assigned to Analog Devices on February, 2024 by the United States Patent and Trademark Office.
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US Patent 11894322 Launch structures for radio frequency integrated device packages
Article
Patent abstract
Radio frequency integrated device packages having bump and/or ball launch structures are disclosed herein. The bump launch structures can comprise patterned metallic and insulating material that substantially matches the impedance of a radio frequency integrated device die. The ball launch structures can comprise patterned metallic and insulating material that substantially matches the impedance of a system board.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Bruce E. Wilcox0
Date of Patent
February 6, 2024
0Patent Application Number
164212210
Date Filed
May 23, 2019
0Patent Citations
Patent Primary Examiner
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