Patent 11904410 was granted and assigned to Corning on February, 2024 by the United States Patent and Trademark Office.
A method for laser preparation of a coated substrate to be laser cut is provided. The method includes substantially removing a target portion of a polymer coating from a coated substrate by directing an ablative laser beam to the target portion, wherein the target portion of the polymer coating has a width of between about 10 μm and about 6.0 mm.