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US Patent 11906802 Photonics integration in semiconductor packages

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
May 10, 2022
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Date of Patent
February 20, 2024
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Patent Application Number
17741349
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Patent Citations
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US Patent 11107770 Integrated electrical/optical interface with two-tiered packaging
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US Patent 11069541 Semiconductor device package for debonding substrate assembly from carrier substrate using light and method of manufacturing same
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US Patent 11611004 Opto-electronic integrated circuit and computing apparatus
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US Patent 9678271 Packaged opto-electronic module
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US Patent 10996412 Electronic device comprising an electronic chip provided with an optical cable
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Patent Inventor Names
Dharmendra Saraswat
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Sam Karikalan
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Liming Tsau
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Sam Zhao
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Reza Sharifi
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Mayank Mayukh
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Arun Ramakrishnan
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11906802
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Patent Primary Examiner
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Rhonda S Peace
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