Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kenichi Murata0
Irizo Naniwa0
Date of Patent
February 20, 2024
0Patent Application Number
177073680
Date Filed
March 29, 2022
0Patent Citations
0
Patent Primary Examiner
Patent abstract
A hard disk drive flexure assembly includes a base layer, a conductive layer, a plurality of electrical pads over the conductive layer, and a sidewall layer including sidewalls on each side of and extending higher than a corresponding electrical pad. Pre-solder bumps are formed between the sidewalls and over each pad. Use of sidewalls prevents the pre-solder bumps from undesirably bridging to an adjacent electrical pad and forming a short circuit, which might otherwise cause head-gimbal assembly (HGA) manufacturing failures and consequent increased cost. These techniques are especially relevant with narrow, high-density, small pitch electrical pads.
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