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US Patent 11915966 Backside power rail integration

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
June 9, 2021
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Date of Patent
February 27, 2024
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Patent Application Number
17342650
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Patent Citations
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US Patent 10700207 Semiconductor device integrating backside power grid and related integrated circuit and fabrication method
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US Patent 10636739 Integrated circuit chip with power delivery network on the backside of the chip
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US Patent 10886224 Power distribution network using buried power rail
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US Patent 9570395 Semiconductor device having buried power rail
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US Patent 10586765 Buried power rails
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Patent Inventor Names
Balasubramanian Pranatharthiharan
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Ruilong Xie
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Albert M. Young
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Takeshi Nogami
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Roy R. Yu
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Brent Anderson
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Kisik Choi
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11915966
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Patent Primary Examiner
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Shahed Ahmed
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CPC Code
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H01L 21/76898
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H01L 21/76895
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H01L 21/823431
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H01L 27/0886
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H01L 23/535
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H01L 23/5286
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H01L 21/76805
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H01L 21/743
0

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