US Patent 11916009 Semiconductor package and manufacturing method thereof
Patent 11916009 was granted and assigned to Taiwan Semiconductor Manufacturing Company on February, 2024 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
May 30, 2022
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Date of Patent
February 27, 2024
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Patent Applicant
Patent Application Number
17827980
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Patent Inventor Names
Sao-Ling Chiu
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Shang-Yun Hou
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Chi-Ming Huang
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Ping-Kang Huang
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
CPC Code
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