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US Patent 11916133 Self-aligned contact structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
February 21, 2022
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Date of Patent
February 27, 2024
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Patent Application Number
17676699
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Patent Citations
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US Patent 9716032 Via-free interconnect structure with self-aligned metal line interconnections
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US Patent 10163691 Low-K dielectric interconnect systems
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US Patent 9972529 Method of forming metal interconnection
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US Patent 10170322 Atomic layer deposition based process for contact barrier layer
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US Patent 9520362 Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components
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US Patent 9613856 Method of forming metal interconnection
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Patent Inventor Names
Li-Zhen Yu
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Cheng-Chi Chuang
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Chia-Hao Chang
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Lin-Yu Huang
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Yu-Ming Lin
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Chih-Hao Wang
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11916133
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Patent Primary Examiner
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Monica D Harrison
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CPC Code
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H01L 21/76834
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H01L 21/76832
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H01L 29/6656
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