Patent attributes
Techniques and mechanisms for coupling packaged devices with a dual-sided socket device. In an embodiment, two interfaces of the socket device comprise, respectively, first metallization structures and second metallization structures on opposite sides of a socket body structure. The first metallization structures each form a respective corrugation structure to electrically couple with a corresponding conductive contact of a first packaged device. The corrugation structures facilitate such electrical coupling each via a vertical wipe of the corresponding conductive contact. In another embodiment, a pitch of the first metallization structures is in a range of between 0.1 millimeters (mm) and 2 mm. One such metallization structure has a vertical span in a range of between 0.05 mm and 2.0 mm, where a portion of a side of the metallization structure forms a corrugation structure, and has a horizontal span which is at least 5% of the vertical span.
