Patent attributes
A socket includes a flat-plate-shaped housing, a plurality of contacts supported by the flat-plate-shaped housing, a frame attached to the flat-plate-shaped housing and extending along the flat-plate-shaped housing, a plurality of first solder balls disposed on a lower surface of the flat-plate-shaped housing and facing a circuit board, and a plurality of second solder balls disposed on the lower surface of the flat-plate-shaped housing. The frame defines, in an in-plane direction of the flat-plate-shaped housing, a position of an electronic component having a lower surface including a plurality of pads configured to contact the contacts upon the electronic component being mounted. The first solder balls electrically connect to each of the contacts and electrically connect to the circuit board. The second solder balls are not electrically connected to the contacts.
