Patent attributes
A wiring substrate includes a first conductive plate, a second conductive plate, and a first insulator. A first end of an element is connected to a first main surface of the first conductive plate, and a second end of the element is connected to a first main surface of the second conductive plate. The first insulator includes a first portion and a second portion. The first portion separates the first conductive plate and the second conductive plate from each other. The second portion is continuous with the first portion, and covers at least a portion of the first main surface. The first portion includes an end portion. The end portion protrudes from the second main surface to the opposite of the first main surface or from the second main surface to the opposite of the first main surface.
