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US Patent 11921428 Substrate processing method and substrate processing apparatus
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Patent
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Date Filed
February 25, 2022
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Date of Patent
March 5, 2024
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Patent Application Number
17680396
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Patent Citations
US Patent 7700494 Low-pressure removal of photoresist and etch residue
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US Patent 7700404 Large die package structures and fabrication method therefor
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Patent Inventor Names
Yoshihiro Uozumi
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Yuji Nagashima
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Shinsuke Kimura
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Yoshihiro Ogawa
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Hideaki Hirabayashi
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Hiroyasu Iimori
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Tatsuhiko Koide
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11921428
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Patent Primary Examiner
Jiong-Ping Lu
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