Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chien-Fan Chen0
Po-Jen Cheng0
Date of Patent
March 5, 2024
0Patent Application Number
171421980
Date Filed
January 5, 2021
0Patent Citations
Patent Primary Examiner
Patent abstract
An electronic device package and a method for manufacturing the same are provided. The electronic device package includes a circuit layer and an electronic component. The circuit layer includes a dielectric layer having an opening, and an electrical contact. A width of an aperture of the opening increases from a first surface toward a second surface. The electrical contact is at least partially disposed in the opening and exposed through the opening. The electronic component is disposed on the second surface and electrically connected to the circuit layer.
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