Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Meng-Wei Hsieh0
Cheng-Yuan Kung0
Date of Patent
March 5, 2024
0Patent Application Number
173832640
Date Filed
July 22, 2021
0Patent Primary Examiner
Patent abstract
A semiconductor device and a method of manufacturing a semiconductor device are provided. The semiconductor device includes a carrier, an element, and a first electronic component. The element is disposed on the carrier. The first electronic component is disposed above the element. The element is configured to adjust a first bandwidth of a first signal transmitted from the first electronic component.
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