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US Patent 11924996 Liquid-cooling devices, and systems, to cool multi-chip modules

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
March 15, 2021
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Date of Patent
March 5, 2024
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Patent Applicant
CoolIT Systems
CoolIT Systems
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Patent Application Number
17201394
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Patent Citations
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US Patent 7209355 Cooling device and an electronic apparatus including the same
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US Patent 7271969 Apparatus for providing high speed, linear-phase interpolation
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US Patent D553170 Cold plate heat sink
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US Patent 7286355 Cooling system for electronic devices
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US Patent 7312987 Adaptable thin plate modular heat exchanger blade for cooling electronic equipment
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US Patent D561711 Heat sink
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US Patent D573110 Heat sink
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US Patent 7420808 Liquid-based cooling system for cooling a multi-component electronics system
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US Patent 7626820 Thermal transfer technique using heat pipes with integral rack rails
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US Patent 6853554 Thermal connection layer
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•••
Patent Inventor Names
Kamal Mostafavi
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Jarod Domingo
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Yixuan Gao
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Brad Zakaib
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11924996
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Patent Primary Examiner
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Adam B Dravininkas
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CPC Code
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H01L 23/367
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H01L 23/3672
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H05K 7/20927
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H05K 7/20254
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H05K 7/20263
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H05K 7/20272
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H05K 7/20409
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H05K 7/20781
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H05K 7/20772
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H05K 7/2079
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•••

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