US Patent 11925001 High power density chips based two-phase loop recirculation

An electronic cooling system is disclosed. The system includes a plurality of cooling plates to extract heat from their respective heat sources. The system further includes one or more vapor separators for extracting vapor from the liquid, with each vapor separator to receive mixed phase liquid and separate the mixed phase liquid into vapor and cooling liquid. The system further includes a return unit to receive the vapors from the vapor separators through one or more vapor loops, and dissipate the received vapors to an external cooling loop. The cooling plates include a first cooling plate that receives liquid phase cooling liquid to extract heat from a first heat source and produces first mixed phase liquid. The cooling plates further include a second cooling plate that uses cooling liquid from a vapor separator to extract heat from a second heat source, produces second mixed phase liquid, and supplies the second mixed phase liquid to the return unit.