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US Patent 11925007 Heat dissipation assembly structure for power part

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
December 20, 2021
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Date of Patent
March 5, 2024
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Patent Application Number
17556109
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Patent Citations
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US Patent 10624244 Automotive power electronics assembly
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US Patent 11553628 Power conversion apparatus, and method of manufacturing power conversion apparatus
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US Patent 6864573 Two piece heat sink and device package
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US Patent 7778036 Structure and method for mounting a heat-generating component
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US Patent 9949405 Electrical device
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US Patent 10321565 Printed circuit board assembly and assembling method thereof
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US Patent 10568206 Printed circuit board assembly and assembling method thereof
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US Patent 10568207 Printed circuit board assembly and assembling method thereof
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Patent Inventor Names
Ji Min Jung
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11925007
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Patent Primary Examiner
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Robert J Hoffberg
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CPC Code
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H05K 7/2049
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H05K 7/20854
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H05K 7/209
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