Create
Log in
Sign up
Golden has been acquired by ComplyAdvantage.
Read about it here ⟶
US Patent 11935783 Selective deposition for integrated circuit interconnect structures
Overview
Structured Data
Issues
Contributors
Activity
Access by API
Access by API
Is a
Patent
0
Date Filed
May 16, 2022
0
Date of Patent
March 19, 2024
0
Patent Application Number
17745614
0
Patent Citations
US Patent 9716032 Via-free interconnect structure with self-aligned metal line interconnections
0
US Patent 9972529 Method of forming metal interconnection
0
US Patent 10170322 Atomic layer deposition based process for contact barrier layer
0
US Patent 10163691 Low-K dielectric interconnect systems
0
US Patent 11222843 Interconnect structure and method for forming the same
0
US Patent 9520362 Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components
0
US Patent 9613856 Method of forming metal interconnection
0
Patent Inventor Names
Shau-Lin Shue
0
Hsin-Yen Huang
0
Cheng-Chin Lee
0
Hai-Ching Chen
0
Shao-Kuan Lee
0
Patent Jurisdiction
United States Patent and Trademark Office
0
Patent Number
11935783
0
Patent Primary Examiner
Dao H Nguyen
0
CPC Code
H01L 21/76834
0
H01L 21/76849
0
H01L 21/76856
0
H01L 21/76897
0
H01L 21/76895
0
H01L 23/5226
0
H01L 23/53295
0
H01L 21/76832
0
H01L 21/76829
0
H01L 21/76807
0
•••
Find more entities like US Patent 11935783 Selective deposition for integrated circuit interconnect structures
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Company
Home
Press & Media
Blog
Careers
WE'RE HIRING
Products
Knowledge Graph
Query Tool
Data Requests
Knowledge Storage
API
Pricing
Enterprise
ChatGPT Plugin
Legal
Terms of Service
Enterprise Terms of Service
Privacy Policy
Help
Help center
API Documentation
Contact Us
SUBSCRIBE