US Patent 11936148 Mechanical grounding clamp
Patent 11936148 was granted and assigned to Hubbell Incorporated on March, 2024 by the United States Patent and Trademark Office.
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US Patent 11936148 Mechanical grounding clamp
Article
Patent abstract
Bonding clamps used to assemble photovoltaic (PV) arrays and provide an electrical bond between PV module frames and a rail system forming the PV arrays are described. The bonding clamp includes an electrically conductive body, first and second compression arms extending from body and a tab extending from the body in a direction away from a bottom side of the body. The first and second compression arms extend at an angle relative to the body.
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Patent Applicant
Current Assignee
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Patent Number
Patent Inventor Names
Evan Ronald Martin0
Date of Patent
March 19, 2024
0Patent Application Number
170127680
Date Filed
September 4, 2020
0Patent Citations
Patent Primary Examiner
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