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US Patent 11937399 Server, liquid cooling device and cold plate assembly
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Patent
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Date Filed
June 14, 2022
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Date of Patent
March 19, 2024
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Patent Application Number
17839721
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Patent Citations
US Patent 10704983 Server
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US Patent 10477725 Clustered heat dissipation device and chassis with same
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US Patent 10952354 Cold plate with metal tube connection and flexible metal tube
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US Patent 7508676 Cold plate structure and method for cooling planar arrays of processors during assembly and test allowing for single module site reworkability
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US Patent 8937810 Electronic assembly with detachable coolant manifold and coolant-cooled electronic module
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Patent Inventor Names
Zhao Geng
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Fanpu He
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Shuai Zhang
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11937399
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Patent Primary Examiner
Zachary Pape
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CPC Code
H05K 7/20727
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H05K 7/20272
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H05K 7/20772
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H05K 7/20781
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H05K 7/20254
0
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