Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Phong T. Tran0
John D. Sylvestri0
Frank L. Pompeo0
David J. Lewison0
Jay A. Bunt0
Richard Walter Oldrey0
Date of Patent
March 26, 2024
0Patent Application Number
169508550
Date Filed
November 17, 2020
0Patent Citations
Patent Primary Examiner
Patent abstract
A method of preparing a computer processor die includes determining a warpage shape of the computer processor die at a testing temperature. The method also includes selectively contouring a thickness of the computer processor die at a contouring temperature by physically removing material from a surface of the computer processor die such that the surface will be substantially flat at the testing temperature.
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