Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kyle K. Kirby0
Date of Patent
March 26, 2024
0Patent Application Number
171085890
Date Filed
December 1, 2020
0Patent Citations
Patent Primary Examiner
Patent abstract
A semiconductor device including a substrate is provided. The device further includes a through-substrate via (TSV) extending into the substrate, and a substantially helical conductor disposed around the TSV. The substantially helical conductor can be configured to generate a magnetic field in the TSV in response to a current passing through the helical conductor. More than one TSV can be included, and/or more than one substantially helical conductor can be provided.
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