Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yu Lei0
Xianmin Tang0
Tae Hong Ha0
Sang-Hyeob Lee0
Jin Hee Park0
Chris Pabelico0
Yi Xu0
Date of Patent
April 2, 2024
0Patent Application Number
174982470
Date Filed
October 11, 2021
0Patent Citations
Patent Primary Examiner
Patent abstract
Apparatuses and methods to provide electronic devices having metal films are provided. Some embodiments of the disclosure utilize a metallic tungsten layer as a liner that is filled with a metal film comprising cobalt. The metallic tungsten layer has good adhesion to the cobalt leading to enhanced cobalt gap-fill performance.
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