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US Patent 11950367 Method for manufacturing electronics assembly

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
July 17, 2023
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Date of Patent
April 2, 2024
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Patent Application Number
18353143
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Patent Citations
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US Patent 7053476 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages
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US Patent 9220172 Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatus
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US Patent 6841418 Multi-substrate microelectronic packages and methods for manufacture
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US Patent 7821346 Ovenized oscillator
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Patent Inventor Names
Ilpo Hänninen
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Mikko Sippari
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Topi Wuori
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Heikki Alamäki
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Mikko Heikkinen
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Pälvi Apilo
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Vinski Bräysy
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11950367
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Patent Primary Examiner
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Donghai D Nguyen
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CPC Code
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H05K 2201/0129
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H05K 1/117
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H05K 1/183
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Y10T 29/4913
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Y10T 29/49133
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Y10T 29/49146
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H01L 23/4334
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H05K 1/111
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H05K 1/181
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H05K 3/4697
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