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US Patent 11951302 Nerve cuff electrodes fabricated using over-molded LCP substrates
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Patent
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Date Filed
June 16, 2022
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Date of Patent
April 9, 2024
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Patent Application Number
17807370
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Patent Citations
US Patent 9889304 Leadless neurostimulator
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US Patent 8792973 Bipolar sieve electrode and method of assembly
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US Patent 9549708 Device for interacting with neurological tissue and methods of making and using the same
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US Patent 7794256 Implantable connector with contact-containing feedthrough pins
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Patent Inventor Names
Siegmar Schmidt
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Boon Khai Ng
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11951302
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Patent Primary Examiner
Catherine M Voorhees
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