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US Patent 11955420 Structures with deformable conductors

Patent 11955420 was granted and assigned to Liquid Wire Inc. on April, 2024 by the United States Patent and Trademark Office.

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Patent abstract

A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

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