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US Patent 11955447 Semiconductor chip having stepped conductive pillars

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
November 17, 2021
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Date of Patent
April 9, 2024
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Patent Application Number
17528523
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Patent Citations
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US Patent 10418318 Fine pitch copper pillar package and method
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US Patent 9324557 Method for fabricating equal height metal pillars of different diameters
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US Patent 9953939 Conductive contacts having varying widths and method of manufacturing same
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US Patent 7829380 Solder pillar bumping and a method of making the same
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US Patent 8659155 Mechanisms for forming copper pillar bumps
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Patent Inventor Names
Farshad Ghahghahi
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Suming Hu
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11955447
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Patent Primary Examiner
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William A Harriston
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CPC Code
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H01L 24/03
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