Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11955454 Wafer bonding apparatus and method

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
February 25, 2022
0
Date of Patent
April 9, 2024
0
Patent Application Number
17681161
0
Patent Citations
‌
US Patent 7998833 Method for bonding wafers
0
‌
US Patent 8489225 Wafer alignment system with optical coherence tomography
0
‌
US Patent 9466538 Method to achieve ultra-high chip-to-chip alignment accuracy for wafer-to-wafer bonding process
0
‌
US Patent 10636688 Method for alignment, process tool and method for wafer-level alignment
0
‌
US Patent 9646860 Alignment systems and wafer bonding systems and methods
0
‌
US Patent 11367712 Semiconductor device and manufacturing method thereof
0
‌
US Patent 7371663 Three dimensional IC device and alignment methods of IC device substrates
0
‌
US Patent 7442476 Method and system for 3D alignment in wafer scale integration
0
Patent Inventor Names
Mengyong Liu
0
Wu Liu
0
Guoliang Chen
0
Yang Liu
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
11955454
0
Patent Primary Examiner
‌
David A Zarneke
0
CPC Code
‌
H01L 2021/60075
0
‌
H01L 24/80
0
‌
H01L 2223/54426
0
‌
H01L 23/544
0
‌
H01L 21/681
0
‌
H01L 2224/80121
0

Find more entities like US Patent 11955454 Wafer bonding apparatus and method

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo