A semiconductor device, including a dielectric layer and a semiconductor substrate, is provided. The dielectric layer has a convexity or a concavity. The semiconductor substrate includes a first type semiconductor layer and a second type semiconductor layer sequentially stacked on the dielectric layer. The first type semiconductor layer is disposed on the convexity or the concavity. A top surface and a bottom surface of the first type semiconductor layer are protruded according to the convexity or recessed according to the concavity. A bottom surface of the second type semiconductor layer is protruded according to the convexity or recessed according to the concavity.