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US Patent 11961867 Electronic device package and fabricating method thereof
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Patent
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Date Filed
June 10, 2022
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Date of Patent
April 16, 2024
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Patent Application Number
17837702
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Patent Citations
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US Patent 8717775 Fingerprint sensor package and method
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US Patent 9129873 Package of finger print sensor and fabricating method thereof
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US Patent 9431447 Package of finger print sensor and fabricating method thereof
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US Patent 9831282 Electronic device package and fabricating method thereof
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US Patent 10692918 Electronic device package and fabricating method thereof
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US Patent 10304890 Electronic device package and fabricating method thereof
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US Patent 10957654 Semiconductor package and method of manufacturing the same
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US Patent 7528420 Image sensing devices and methods for fabricating the same
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US Patent 7851246 Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device
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Patent Inventor Names
Se Woong Cha
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Ju Hoon Yoon
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Sung Kyu Kim
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Seung Jae Lee
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Jin Young Kim
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No Sun Park
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Yoon Joo Kim
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11961867
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Patent Primary Examiner
Victor A Mandala
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CPC Code
H01L 21/568
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H01L 2224/04105
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H01L 2224/211
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H01L 2224/214
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H01L 2924/12042
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H01L 2924/181
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H01L 2924/18162
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H01L 23/12
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H01L 23/48
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H01L 2924/00
0
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