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US Patent 11963341 High temperature electronic device thermal management system
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Patent
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Date Filed
September 15, 2021
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Date of Patent
April 16, 2024
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Patent Application Number
17475398
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Patent Citations
US Patent 10426062 High pressure, energy efficient data center
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US Patent 10985089 Semiconductor cooling arrangement
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US Patent 11018077 Modular microjet cooling of packaged electronic components
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US Patent 11322426 Thermal management of RF devices using embedded microjet arrays
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US Patent 11439037 Jet vectoring fluid impingement cooling using pivoting nozzles
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US Patent 11594470 Modular microjet cooling of packaged electronic components
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US Patent 11710678 Combined architecture for cooling devices
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US Patent 6952346 Etched open microchannel spray cooling
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US Patent 6973801 Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack
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US Patent 7007506 Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator
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•••
Patent Inventor Names
Bernard Malouin
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Jordan Mizerak
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11963341
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Patent Primary Examiner
Mukundbhai G Patel
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CPC Code
H05K 7/20836
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