An apparatus for removing debris from under a machining location is formed of a static collection surface located below the machining location having a transition portion laterally offset from the machining location and a fluid discharge positioned above the transition portion. The fluid discharge includes a fluid source and a reservoir having an interior adapted to receive and contain a quantity of a fluid from the fluid source for a period of time. The fluid sicharge is adapted to periodically discharge the fluid therefrom so as to be guided by the transition portion across the collection surface to sweep the debris off the static collection surface towards a collection point.