US Patent 11966159 Organometallic solution based high resolution patterning compositions
Patent 11966159 was granted and assigned to Inpria on April, 2024 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 6, 2022
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Date of Patent
April 23, 2024
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Patent Applicant
Patent Application Number
17903605
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Patent Citations
•••
Patent Inventor Names
Andrew Grenville
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Kai Jiang
0
Stephen T. Meyers
0
Jeremy T. Anderson
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Douglas A. Keszler
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
CPC Code
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